Flip-chip pin grid array
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Flip-Chip Pin Grid Array (FC-PGA or FCPGA) is the package of certain Intel Celeron, Pentium III, and Pentium 4 microprocessors. FC-PGA processors fit into Socket 370 or Socket 478 motherboard sockets.
The Flip Chip Pin Grid Array is similar to PPGA, except that the silicon core is facing up and the heat slug is exposed.
FC-PGA packaging is used by Pentium III processors, and Celeron 533, unofficially called 533A, processors onward. Earlier Celeron processors used PPGA packaging, the fastest was at 533 MHz.
A revision to the Flip Chip Pin Grid Array, FC-PGA2, adds a heat spreader over the silicon core. It is used on late Pentium III processors and most Pentium 4 and Celeron processors using Socket 478. The FC-PGA2 packaging has been replaced by the land grid array (LGA775) packaging on Prescott-based Pentium 4 and Celeron D processors.
Celeron processors are also available in Slot 1 SEPP. Pentium III processors are also available in Slot 1 Single Edge Contact Cartridge 2 packaging. Pentium 4 processors are also available in Socket 423 Organic Land Grid Array (OLGA) on Interposer (OOI) (INT2 and INT3) and Socket T LGA775 packaging.
Adapters are available to allow a PPGA Celeron to plug into a Slot 1 connector.