Dual in-line package
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de:Dual in-line package pl:Dual in-line package Image:DIL14 IC HCF4093.jpg Image:Nec8080.png In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, usually protruding from the longer sides of the package and bent downward. A DIP is usually referred to as a DIPn, where n is the total number of pins.
DIPs may be used for integrated circuits (ICs, "chips"), like microprocessors, or for arrays of discrete components such as resistors or toggle switches. They can be mounted on a printed circuit board (PCB) either directly using through-hole technology, or using inexpensive sockets to allow for easy replacement of the device. A typical DIP may be a microcircuit package with two rows of seven vertical leads (i.e., a DIP14).
The most common DIPs have an inter-lead spacing (lead pitch) of 0.1" (2.54 mm) and a row spacing of either 0.3" (7.62 mm) or 0.6" (15.24 mm). Typical pin counts are 8 or any even number from 14 to 24 (less common 28) for 0.3" packages, and 24, 28, 32 or 40 (less common 36, 48 or 52) for 0.6" packages. JEDEC-standards also specify less common packages with a row spacing of 0.4" (10.16 mm), or 0.9" (22.86 mm) with a pin-count of up to 64. Other standardized variants include a lead pitch of 0.07" (1.778 mm) at a row spacing of 0.3", 0.6" or 0.75".
Several DIP variants exist, mostly distinguished by packaging material:
- Ceramic Dual In-line Package (CERDIP)
- Plastic Dual In-line Package (PDIP)
- Shrink Plastic Dual In-line Package (SPDIP) – A shrink version of the PDIP with a 0.07" (1.778 mm) lead pitch
DIPs were the mainstream of the microelectronics industry in the 1970s and 80s. Their use has subsided in recent years due to the emerging new surface-mount technology (SMT) packages such as PLCC and SOIC.
For programmable devices like EPROMs and GALs, DIPs remained popular for many years due to their easy handling with external programming circuitry. However, with In-System Programming (ISP) technology now state of the art, this advantage of DIPs is rapidly losing importance as well.
Sources
- Intel (1996). Packaging (databook). ISBN 1-55512-254-X.